Semiconductor Fused Silica Wafer Quartz Glass

Semiconductor Fused Silica Quartz Glass wafer

Specifications
specifications designed to your unique needs including, alignment marks, holes, pockets, edge profile, thickness, flatness,
surface quality, cleanliness or any other details critical to your application. We also offer these wafers in a broad array of
materials including Borosilicate, Aluminosilicate, Fused Silica (instead of quartz), Quartz and Soda Lime.
The following describes the versatility within several of our key processes. For full details on the process, please contact us
freely get more information.

Process

Shape Cut

Thin sheets are scribed, thick sheets are water jetted and blocks are wire sawn to begin the process with a wafer "blank".

CNC Edge

Each wafer is individually edged on a Precision CNC Edge Grinding Station.

Lapping

As required, wafers are lapped to precise thickness or flatness.

Polishing

Double-side Commercial Polish removes subsurface damage and Super Polish creates a pristine finish.

Cleaning

We combine ultrasonics and megasonics on multiple cleaning lines which feed directly into a Class Clean Room.

Inspection

In our Class 100 Optical Clean Room, we inspect to various quality levels under the appropriate lighting conditions.

Packaging

All wafers are packed in pre-cleaned containers, double bagged and vacuum sealed within the Class 100 Clean Room.